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    Work package descriptions​

    WP1
    WP2
    WP3
    2D Material Growth
    and investigation of substrates.
    Laser Direct Transfer (LDT) process: LIBT and LIFT.
    Application 1. 2D SC enabled emitter integrated on Si photonic chip.
    WP4
    WP5
    WP6
    Application 2. Graphene enabled flexible touch sensor.
    Dissemination and Exploitation.
    Project Management.

    © 2020 Leaf2D

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    This project has received funding from the European Union’s Horizon 2020 research

    and innovation programme under grant agreement No 801389.

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    The content of this website reflects only the views of its authors.

    The European Commission is not responsible for any use that may be made of the information it contains