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Work package descriptions
WP1
WP2
WP3
2D Material Growth
and investigation of substrates.
Laser Direct Transfer (LDT) process: LIBT and LIFT.
Application 1. 2D SC enabled emitter integrated on Si photonic chip.
WP4
WP5
WP6
Application 2. Graphene enabled flexible touch sensor.
Dissemination and Exploitation.
Project Management.
